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A technical overview of Q&T's polymer substrate platform, embedded OVD architecture, layered security features, and production assurance for institutional evaluation.
A banknote-grade polymer substrate platform manufactured in Vietnam and structured for durability, window security, print compatibility, and programme-specific evaluation.
Q&T's next-generation embedded OVD architecture, designed to move optically variable security from surface exposure into the protected substrate structure.
Layered Level 1, Level 2, and Level 3 controls covering public optics, trained-handler checks, and machine-readable authentication.
Process control, inspection, traceability, and quality documentation aligned with sovereign procurement and security-printing requirements.